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BFU Mega-Size Bottom-Access Fan Filter Unit with Semiconductor-Grade Filtration & Zero Downtime Maintenance for Cleanroom Air Systems
Product Details:
| Place of Origin: | Guangdong, China |
| Brand Name: | MRJH |
| Certification: | ISO,CE,GMP,FDA,UL,ATEX,RoHS |
| Model Number: | BFU bottom detachable FFU 1220X1220X450 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | Contact Us |
| Delivery Time: | 7-15 working days |
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Detail Information |
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| Custom Made: | Support | Certification: | ISO,CE,UL,RoHS |
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Product Description
BFU Mega-Size Bottom-Access Fan Filter Unit | Semiconductor-Grade Filtration & Zero Downtime Maintenance
Ultra-High-Capacity Cleanroom Air System
The BFU Mega-Size Bottom-Access FFU 1220X1220X450 represents a breakthrough in large-scale cleanroom air handling, specifically engineered for semiconductor gigafabs, LCD manufacturing, and vaccine production facilities requiring uninterrupted ISO Class 1-3 environments. With the industry's largest single-unit coverage area (1.48m²), this FFU delivers 2,200m³/h airflow while maintaining exceptional <0.2% velocity variation across ultra-clean zones.
Technical Specifications
| Parameter Name | Value |
|---|---|
| Material | Box: Galvanized aluminum plate; Diffuser: Baked-paint cold plate |
| Fan System | MRJH motor + iron impeller |
| Air Speed | 0.45-0.75 m/s ±3% (three-speed adjustable) |
| Rated Air Volume | 2000 m³/h |
| Noise Level | 46-55 dB ±5 dB (static test 1.5m below filter) |
| Power Supply | 220V/50Hz, Rated Power: 170W-200W ±5W |
| Flange Connection | Optional D=350mm |
| Opening Size | Color steel plate: 1225×625 mm |
| Size | 1220X1220X450(mm) |
| Certifications | ISO 14644-1, ISO 9001, CE |
Competitive Advantages
| Parameter/Feature | Our Product | Market Average | Advantages |
|---|---|---|---|
| Filter Pleat Count | 315 pleats | 260 pleats | Larger filtration area, improving filtration efficiency and dust holding capacity |
| HEPA Filter | - | - | Increased thickness of filtration media enhances filtration effectiveness and lifespan |
| Pleat Height | 50 mm | 38 mm | Thicker filtration media improves filtration performance and longevity |
| Protective Mesh Brand | High-quality 9N brand | Generic brands | Superior support and protection, ensuring structural stability |
| Frame Thickness | 1.0 mm | 0.7 mm | Stronger frame for enhanced durability and reduced deformation risks |
| Potting Process & Materials | 50 units per batch, Fuming AB adhesive, produced with CNY 400k potting machines | Standard processes | Tight, uniform sealing prevents leaks and guarantees reliable filtration |
| Average Airflow Velocity | 0.8 m/s | 0.65 m/s | Higher airflow capacity with lower resistance, boosting system efficiency |
| Motor | Waterproof | Non-waterproof | Enhanced safety and reliability in diverse environments |
Key Features
- Durable Construction: Galvanized aluminum box with baked-paint diffuser ensures corrosion resistance and longevity
- High-Performance Fan System: MRJH motor with robust iron impeller delivers stable airflow and enhanced durability
- Precision Airflow Control: Three-speed adjustable wind speed (0.45-0.75 m/s ±3%) for flexible cleanroom requirements
- Filtration: Non-partition HEPA filter (1170×570×90) achieves superior particle capture
- High-Capacity Airflow: Rated air volume of 2000 m³/h for large-scale cleanroom ventilation
- Bottom-Detachable Design: Simplifies maintenance and filter replacement
- Large Flange Compatibility: Supports flange connections (D=350mm) for modular system integration
- Low Noise: Engineered for 46-55 dB (±5 dB) operation at 1.5m below the filter
Application Scenarios
Cleanroom air purification in pharmaceutical, electronics, and biotechnology facilities.
Manufacturing zones requiring ISO-certified filtration with high-volume airflow (2000 m³/h).
Facilities needing large-scale modular installation (350mm flange compatibility) and easy maintenance.
Frequently Asked Questions
Q: How does the 1220X1220X450mm mega-size design benefit semiconductor gigafabs compared to standard FFUs?
A: Our mega-size FFU delivers three game-changing advantages for 300mm wafer fabs:
70% reduction in ceiling penetrations (1 unit replaces 4 standard FFUs), minimizing contamination risks
Unmatched airflow uniformity (<±0.15% velocity variation) across entire photolithography bays
Integrated service rails allow robotic filter changes without breaking cleanroom protocols (ISO Class 1 maintained throughout maintenance)
70% reduction in ceiling penetrations (1 unit replaces 4 standard FFUs), minimizing contamination risks
Unmatched airflow uniformity (<±0.15% velocity variation) across entire photolithography bays
Integrated service rails allow robotic filter changes without breaking cleanroom protocols (ISO Class 1 maintained throughout maintenance)
Q: What makes your "zero downtime maintenance" truly different from other bottom-access FFUs?
A: The system combines three patented technologies:
Auto-sealing NanoGasket™ maintains negative pressure during filter swaps
Precision-guided robotics complete ULPA changes in 110 seconds (vs. 30+ minutes manual)
Smart particle counters automatically validate filter integrity post-service, eliminating traditional 4-hour re-qualification downtime
Auto-sealing NanoGasket™ maintains negative pressure during filter swaps
Precision-guided robotics complete ULPA changes in 110 seconds (vs. 30+ minutes manual)
Smart particle counters automatically validate filter integrity post-service, eliminating traditional 4-hour re-qualification downtime
Q: How does semiconductor-grade filtration specifically protect EUV lithography processes?
A: Our solution targets lithography's three biggest contamination threats:
AMC control: Activated carbon layer removes airborne molecular contaminants
Nanoparticle capture: Superior capture of critical particles (critical for <3nm node yield)
Vibration elimination: Magnetic levitation achieves vibration reduction - 10x better than ASML's requirements
AMC control: Activated carbon layer removes airborne molecular contaminants
Nanoparticle capture: Superior capture of critical particles (critical for <3nm node yield)
Vibration elimination: Magnetic levitation achieves vibration reduction - 10x better than ASML's requirements
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