Semiconductor & Electronics Manufacturing Cleanroom Solutions

I. Semiconductor Fabrication Solutions

1. Photolithography

   • ISO Class 3-5 Cleanrooms:
     FFUs with ULPA filters (99.9995% @ 0.12μm) maintain ≤1,000 particles/m³ to prevent mask contamination.

   • Vibration-Damped Laminar Flow Hoods:
     Achieve <0.5μm overlay alignment accuracy via seismic isolation platforms.

2. Etching & Deposition

   • Gas-Tight Modular Cleanrooms:
     Chemically resistant walls + AMC (Airborne Molecular Contamination) filters to control HF/O₃ levels <1 ppb.

   • Pass Boxes with Nitrogen Purge:
     Transfer wafers between plasma etch and ALD chambers without oxidation.

3. Advanced Packaging & Testing

   • ESD-Safe Dry Rooms (ISO Class 4):
     Maintain ≤10% RH with desiccant wheel systems for 3D IC stacking.

   • RF Shielded Cleanrooms:
     Faraday cage modules + FFUs for 5G/Wi-Fi 6E chip probe testing.

II. Display Panel Manufacturing

1. OLED Evaporation

   • Vacuum Load-Lock Cleanrooms:
     Modular chambers with magnetic levitation transfer robots (Class 100 environment for organic layer deposition).

   • Oxygen-Free Glove Boxes:
     <0.1ppm O₂ for cathode sputtering to prevent luminescence quenching.

2. MicroLED Mass Transfer

   • ISO Class 2 Pick-and-Place Zones:
     ULPA-filtered laminar flow + 10nm precision vibration control for die bonding.

   • Anti-Static Pass-Throughs:
     Conductive trays eliminate charge buildup during 50μm LED chip handling.

III. Precision Electronics Production

1. PCB Manufacturing

   • Dust-Control Cleanrooms (ISO Class 6):
     FFUs remove drilling debris (≥0.3μm) to prevent short circuits in HDI boards.

   • Humidity-Stable Lamination Zones:
     Maintain 45±5% RH for multilayer PCB alignment (±25μm tolerance).

2. Sensor Fabrication

   • Nano-Particle Free Cleanrooms:
     ULPA filtration (ISO Class 3) for MEMS gyroscope etching (structure gaps <2μm).

   • Temperature-Humidity Calibration Chambers:
     Modular cleanrooms with ±0.1°C stability for IoT sensor testing.

IV. Core Advantages

• Yield Optimization: Reduce defect density to <0.01/cm² in 5nm node production.

• Energy Efficiency: 40% lower operational costs via smart FFU airflow management.

• Compliance: Meet SEMI F21, ISO 14644-1 Class 3, and JEDEC EIA-625 standards.

• AI-Driven Predictive Maintenance: Real-time particle monitoring with machine learning anomaly detection.